IT News on November 4th: According to a report by the South Korean media "Daily Economy" yesterday, Samsung Electronics' wafer foundry business plans to produce HBM base chips ( Base Die ) for customers such as AMD at its second wafer factory in Taylor, Texas, USA.
IT has noted that the first wafer factory of Samsung's wafer foundry Taylor cluster will be put into operation within 2026; the second wafer factory will begin construction this month and is expected to be operational by 2030.
Samsung's wafer foundry mainly supplies HBM basic chips to its own memory business. Since the HBM4 generation, the in-house processes of memory manufacturers have gradually been unable to meet the performance requirements of the basic chips used for communication at the bottom layer of the HBM stack and with the XPU. In the future, when customizing HBM, some of the XPU functions will also need to be offloaded onto these basic chips. As a result, memory manufacturers have begun to place orders for the production of basic chips with external, advanced process foundry companies.
Industry insiders believe that in addition to being supplied to AMD, the HBM base die manufactured by Samsung's second wafer foundry, Taylor, may also be used in the AI ASIC products that Broadcom creates for its customers.
refer to
https :// www.mk.co.kr / news / business /12195087
