IT News on November 1st: Lee Jae-yong, President of Samsung Electronics, visited the Advanced Packaging Research Center ( APL ) located in Yokohama, Japan, today. He inspected the progress of research and development on next-generation semiconductor packaging materials and processes on-site and discussed with local researchers ways to strengthen cooperation with Japanese companies in semiconductor materials, components, and equipment.

It is reported that Samsung Electronics plans to invest 40 billion yen (Note from IT: the current exchange rate is approximately 1.693 billion yuan) over the next five years starting from 2024, aiming to transform Yokohama APL into a global advanced packaging R&D center. By 2027, the company also plans to expand the local R&D team to over 100 people. The research areas will be extended to include next-generation packaging technologies such as wafer bonding and glass substrates.

IT noticed that Samsung Electronics (Samsung Electronics) held the opening ceremony for its Advanced Packaging Laboratory (APL) in Yokohama, Japan, on September 8th local time. Representatives from both the company and the government attended the event. Yokohama is located within the Tokyo metropolitan area of Japan and is also the headquarters of Resonac (Linsen Nokko) and DISCO (DigiCore), bringing together many key enterprises in the semiconductor packaging industry chain. Samsung's APL facility has a total construction area of about 6,600 square meters and is equipped with semiconductor-grade clean rooms.