Compal Electronics, Inc. (Compal; TWSE : 2324) indicates that the company will showcase its next-generation AI factory infrastructure at OCP Global Summit in 2026, demonstrating how power supply, cooling, computing power, and rack-level engineering evolve together to meet the rapidly growing demands of NVIDIA accelerated computing.
According to Compal, as the AI data centers achieve unprecedented computing density and megawatt-level energy demands, the challenge is no longer merely about adding more GPU. The infrastructure surrounding accelerated computing – from power supply to thermal management, to rack integration – must be redesigned to ensure the performance, efficiency, and scalability required for the next generation of AI workloads.
At the OCP conference, Compal will demonstrate how it has accelerated the development of this infrastructure around NVIDIA, and combined the high-density computing platform with new generation power supply and cooling technologies to create a more integrated and scalable AI factory foundation.
Redesign the power supply system of the AI factory
Compal indicates that the power supply architecture is becoming one of the key challenges faced by large-scale AI infrastructure. To meet the rapidly increasing demand for rack power density, companies are advancing the development of 800V DC power supply architectures and power supply infrastructure capable of handling megawatt levels, in order to adapt to the requirements of the next generation of AI data centers.
By transitioning to a direct current architecture with higher voltages and more efficient power supply methods, Compal aims to reduce the complexity of power conversion and support increasingly dense AI environments. This solution is designed to establish a scalable power supply foundation that can evolve in tandem with future generations of accelerated computing capabilities.
Towards higher-density cooling infrastructure
Higher computational density also requires fundamental changes in thermal management methods. Compal is expanding its infrastructure product portfolio by incorporating advanced liquid cooling technology and megawatt-level cooling capabilities, ensuring that AI systems can continue to operate efficiently even as rack density continues to increase.
Compal indicates that the company does not regard computing power, power supply, and cooling as independent systems, but rather develops them as interrelated components within the AI factory. By coordinating these technologies at the rack and data center levels, Compal can better match the infrastructure with the demands of high-performance accelerated computing.
Evolution from the power grid to GPU
According to Compal, these capabilities collectively reflect the company's transition from a single server platform to a broader AI infrastructure strategy. By integrating accelerated computing, power supply, cooling, and rack-level solutions with global R&D and manufacturing resources, Compal aims to help customers bridge the gap between advanced AI technologies and large-scale practical deployments.
VP Alan Chang stated: "Building the next generation of AI factories requires us to rethink the entire infrastructure surrounding accelerated computing. Compal combines power supply, cooling, rack integration, and NVIDIA accelerated computing to help customers build AI infrastructure that can be efficiently scaled to megawatt-level deployments at the platform level."
According to Compal, at the OCP conference, the company will demonstrate how these infrastructure technologies can work together to address the growing challenges in power supply, heat dissipation, and deployment in the AI era, and to build critical infrastructure from the power grid to GPU.
Compal invites participants to visit booth E65 during OCP Global Summit 2026 to learn about the next generation of AI factory infrastructure based on NVIDIA technology.
About Compal
Compal was established in 1984 and has since developed into a global leader in computer and smart device manufacturing, collaborating with top brands worldwide. The company has been recognized by CommonWealth Magazine as one of Taiwan's seven major manufacturers and has long been listed among Forbes' Global 2000 strongest companies. Compal has actively expanded into new growth areas such as cloud servers, automotive electronics, intelligent healthcare solutions, and advanced communication solutions. Headquartered in Taipei, Taiwan, China, the company also has R&D and production facilities in the United States, Taiwan, China, Vietnam, Mexico, Brazil, and Poland. For more information, please visit https :// www.compal.com.
