According to CoinMeta, an analyst from KeyBanc recently visited Asia and pointed out that Intel has secured contract manufacturing orders from companies such as Broadcom, Google, Apple, AMD, Microsoft, and NVIDIA, and is optimistic about the revenue opportunities brought by 14A manufacturing processes and advanced packaging technologies. However, the list of relevant customers, the scope of the contracts, and the amounts involved have not yet been officially confirmed by these companies. It is estimated that Apple-related projects may involve approximately 600,000 wafers, with potential revenue opportunities ranging from 15 billion to 20 billion US dollars. Anthropic is still evaluating the situation, and the potential quantity of customized special application chip (ASIC) projects could reach 5 to 10 million units. If advanced packaging is taken into account, the revenue opportunities could amount to 40 to 80 billion US dollars. In terms of advanced packaging, Google's Humufish TPU, v9, Icefish TPU, and v10 related projects could bring Intel approximately 12 to 15 billion US dollars in revenue opportunities.