NVIDIA and Cisco jointly launch a new generation of ultra-high density pluggable optical module standard USFP. The first product supports single-channel 400Gb/s electrical signals, with a bandwidth density that is four times higher than existing solutions, marking a new phase in AI data center interconnection technology.

On October 12, the two companies announced the aforementioned plan and collaborated with TE Connectivity and Anfeino (Amphenol) to build a hardware ecosystem that encompasses the research, development, and production of cages, connectors, and modules. Meanwhile, NVIDIA and Cisco plan to promote USFP as an open industry standard through a community-led multi-source project.

The release of USFP directly addresses the interconnection bottlenecks brought about by the expansion of the AI factory scale. As the demand for AI model training and inference continues to grow, insufficient switch port bandwidth will force operators to add more network layers, leading to increased latency, power consumption, and construction costs. If the new standard can be implemented on time and widely adopted by the industry, it will have a substantial impact on the reshaping of the optical module supply chain landscape.

Performance boost: Four times the bandwidth density, while also considering energy efficiency.

The core breakthrough of USFP lies in increasing the single-channel electrical signal rate from 200Gb/s to 400Gb/s. The first planned product encapsulates 16 full-duplex channels within the same module size as the existing OSFP, achieving an aggregated capacity of 6.4Tb/s, and reserves an upgrade path to expand to 32 channels for a total capacity of 12.8Tb/s.

Compared to 200Gb/s single-channel pluggable modules of the same size, USFP achieves four times the bandwidth and approximately 1.3 times the increase in front-panel bandwidth density. Gilad Shainer, Senior Vice President at NVIDIA, stated, "Building the world's largest AI factory begins with a rethinking of the smallest connections."

In terms of thermal design, USFP supports a maximum power consumption of 100 watts and does not require an integrated cooling circuit within the transceiver, effectively reducing the complexity of the switch design and enhancing overall reliability.

Connector Innovation: Two-Dimensional Array Structure Breaks Through Signal Integrity Bottlenecks

USFP adopts a brand-new two-dimensional array connector, combined with a two-step insertion design – after the module is physically inserted, the high-speed contacts are then mated. This mechanism effectively reduces contact wear, improves signal integrity, and makes the insertion force more predictable.

This connector architecture is specifically designed for 400Gb/s performance, while also providing improved signal performance for 200Gb/s single-channel operations, thus providing a compatible foundation for the smooth transition of existing systems. Bill Gartner, Senior Vice President and General Manager of Cisco's Optical Systems and Optical Components Business, pointed out that extending pluggable optical modules to 400Gb/s single-channel requires not only a progressive extension of the existing module design but also a full-stack collaborative optimization that covers chips, systems, optical components, and network operating systems.

USFP also supports a variety of optical technologies and connection distances, enabling system designers to flexibly handle different AI factory deployment scenarios.

Ecosystem Construction: TE Connectivity and Anfeinuo Enter the Game to Reshape the Supply Chain

NVIDIA and Cisco have involved TE Connectivity and Amphenol in the development of USFP frameworks, connectors, and modules, which is the most direct impact on the supply chain mentioned in this announcement. Both companies are major suppliers in the connector industry, and their confirmation of participation indicates that a preliminary multi-source supply pattern has been established at the hardware foundation level for USFP. It is expected that more partners will join in the future.

Unified module form factor specifications provide a common development foundation for suppliers, facilitating the establishment of a scaled and competitive supply system centered around 400 Gb/s single-channel interconnection. This model continues the tradition of the pluggable optical module ecosystem, which has always emphasized interoperability and supplier diversity. Compared to solutions such as co-packaged optics ( CPO ), it offers differentiated advantages in terms of on-site replaceability and supply chain maturity.

This collaboration is also built upon the existing synergy between the NVIDIA Spectrum -X Ethernet network and Cisco’s Sil token issuance n One Ethernet network, with the aim of simplifying AI infrastructure deployment for enterprises, new cloud service providers, and sovereign cloud customers.

Open standard paths: Multi-source specification projects lower the deployment threshold

NVIDIA and Cisco plan to promote USFP to become an open industry standard through a community-led multi-source project that is about to be launched. The establishment of an open standard will lower the barriers for a wider range of manufacturers to participate in the ecosystem and provide greater flexibility for data center operators in their procurement and replacement decisions.

For the builders of the AI factory, the value proposition of USFP is reflected in two dimensions: firstly, to expand the computing capacity without adding new network layers, thereby avoiding the delays and increased costs associated with additional exchange layers; secondly, by increasing the data transmission volume per watt, to reduce the proportion of network interconnection costs within the overall power consumption budget of the AI factory.

It should be noted that currently, NVIDIA and Cisco have not disclosed specific product launch or mass production timelines, and USFP is still in the design and planning phase. Its ultimate market impact will depend on the pace of advancement of open standards, the speed of expansion of the partner ecosystem, and the actual choices made by the industry among different optical interconnection approaches such as pluggable, near-packaging, and co-packaging.

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