According to CoinMeta, ChangXin Memory has begun small-scale production of HBM3E and plans to increase production in 2027. HBM is a type of high-speed memory placed next to AI chips, responsible for quickly transferring data to the chips. The United States started restricting the export of HBM2 and higher-grade products to China in 2024, which has always been a major weakness for domestically produced AI chips. Domestic chip teams such as Cambricon and Alibaba PingTouGe have been testing ChangXin's HBM; if progress goes well, it could be used in products as soon as next year. Currently, ChangXin's technology is only one generation behind that of SK Hynix, as well as the products being mass-produced by Samsung and Micron. However, there is still a distance to go before reaching mature mass production, with current yield rates being lower and speed and reliability not matching those of the three major manufacturers. SK Hynix began mass production of HBM3E as early as 2024, and now the three major manufacturers have entered the HBM4 stage and have started sending samples of HBM4E. What ChangXin has overcome this time is the hurdle of "whether it can be produced at all"; the next challenge is to truly improve yield rates and increase production volumes.