According to CoinMeta, as reported by the Seoul Economic Daily, Samsung Electronics is developing 8-layer HBM4E products at the request of NVIDIA for NVIDIA's custom high-bandwidth memory NVHBM. NVIDIA requires a target speed of 17 to 18 Gbps, which is about a 20% increase from the 14.4 Gbps of Samsung's earlier HBM4E samples. The 8-layer design can reduce stacking difficulties and enhance supply capacity. This NVHBM may start to be applied from next year's Rubin Ultra AI GPU, and the interconnection scale of GPU in Rubin Ultra will increase from 72 to a maximum of 576 chips.